Thermal extraction architectures for camera and lighting devices

ABSTRACT

Thermal extraction architectures for heat-generating electronic devices such as digital cameras or lights are disclosed.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of and claims priority to co-pendingU.S. patent application Ser. No. 13/775,066, filed Feb. 22, 2013,entitled THERMAL EXTRACTION ARCHITECTURE FOR CAMERA HEADS, INSPECTIONSYSTEMS, AND OTHER DEVICES AND SYSTEMS, which claims priority under 35U.S.C. §119(e) to United States Provisional Patent Application Ser. No.61/602,063, filed Feb. 22, 2012, entitled THERMAL EXTRACTIONARCHITECTURE CAMERA HEADS & INSPECTION SYSTEMS. The content of each ofthese applications is hereby incorporated by reference herein in itsentirety for all purposes.

FIELD

This disclosure relates generally to devices and systems with heatsensitive components such as camera heads, lights, or other electronicswith heat-generating components. More specifically, but not exclusively,the disclosure is directed to camera heads or lighting devices thatinclude thermal extraction elements configured to extract heat from heatsensitive devices and transfer the heat to a housing to improveperformance, reliability, and/or life expectancy.

BACKGROUND

The potential for overheating is a known issue within many known devicesand systems. For instance, camera head components such as digitalimaging sensors that generate heat or are subject to significant heatexposure from other components during operation can be damaged ordestroyed, as can other components. This may be particularly true forcamera heads where the camera is enclosed, such as where a camera'sparticular use requires a compact and/or largely air or water tightpackage, such as in a pipe inspection camera. Enclosed lights or otherelectronic devices may be subject to similar heating problems.

During operation, continuous use of these camera heads, such as thoseused in video inspection systems, may cause components to heat up overtime and exceed heat limitation specifications required or recommendedby the camera's manufacturer. In such cases, heating may cause variousproblems. For example, the inability to extract heat from sensitivecomponents may cause overheating and in turn create noise on thecaptured images and video, may damage internal components, may shortenthe lifespan of the camera, may void manufacturer warranties, and/or maycause other problems.

Accordingly, there is a need for improved camera heads and other heatsensitive systems and devices configured to effectively extract heataway from heat sensitive components, as well as provide other potentialadvantages in camera systems or other devices or systems where heatingoccurs.

SUMMARY

In accordance with various aspects, a camera head with a thermalextraction architecture configuration may include a housing or mountingassembly or other component including a thermal contact area, a printedcircuit board (PCB), and a thermal extraction (also denoted herein as“extracting”) element disposed between the PCB and housing to transferheat from the PCB to the housing and external environment.

The PCB may contain a series of thermal extracting, electricalconnecting, and/or insulating layers. The thermal extracting layer orlayers and/or electrical connecting layer or layers may alternate withinsulating layers between each, such that the thermal extracting layersnever directly come in contact with the electrical connecting layers.The sides or other areas or surfaces of the thermal extraction PCB maybe configured to allow the thermal extraction piece or element to makecontact with the thermal extracting layer or layers to conduct heat awayfrom the PCB, such as at the contact areas. In turn, the thermalextracting piece or element may contact the housing or assembly toconduct heat from the PCB to the housing or assembly. A reduction ofthermal resistance to heat sensitive components on the specialized PCBmay be achieved whereby heat may be channeled away from sensitivecomponents through the thermal extracting layers, through the thermalextraction element, and redistributed to the camera head housing orassembly. In some embodiments, the camera head may have several PCBs ora PCB stack where a thermal extraction element may be used for each PCB.

In another aspect, a thermally conductive shoe or ring may be securedalong the edge of a thermal extracting PCB, such as by solder. Thethermally conductive shoe may contact a thermal extraction element thatfurther redistributes heat away from sensitive components on the PCB andto the device housing or assembly. In some embodiments a stack ofmultiple thermal extracting PCBs may be used, in which case each PCB mayreceive a thermally conductive ring and a single thermal extractionelement may encapsulate the stack of thermal extracting PCBs to providebulk heat transfer. In yet other embodiments where a stack of multiplethermal extracting PCBs may be used, each PCB may receive a thermallyconductive shoe as well as an individual thermal extraction element foreach thermal extracting PCB.

In another aspect, the camera head may include a lighting element togenerate light for illuminating a subject area, for instance using lightemitting diodes (LEDs).

In another aspect, a thermal extraction architecture camera head may beconfigured for use in a camera system or other heat generating device orsystem. The camera system may be configured for use in a pipe inspectionsystem or other closed area or cavity inspection system.

In another aspect, a thermal extraction PCB may be a rectangular,square, or other non-round shape. Furthermore, the thermal extractionelement or elements need not fully encapsulate the sides of the thermalextraction PCB or PCBs. For instance, some embodiments may have onethermal extraction element only along one or two sides of a rectangularthermal extraction PCB.

In another aspect, the thermal extraction architecture described hereinin combination with camera heads may also be used in a wide variety ofother systems and devices where cooling of internal components is neededor desired. For instance, some LED lighting systems may benefit fromcooling of stacks of LED drivers using such thermal extractionarchitecture.

In another aspect, the disclosure is directed to an electronic device,such as a camera, lighting device, or embedded computing or processingdevice. The device may include, for example, a printed circuit board(PCB). The printed circuit board may include a PCB thermal extractionarea. The device may further include a housing assembly elementincluding a housing thermal contact area. The device may further includea thermal extraction element including a first thermal contact area inthermal contact with the PCB thermal extraction area and a secondthermal contact area in thermal contact with the housing thermal contactarea. Heat may be transferred from the PCB to the thermal extractionelement and then to the housing and external environment.

In another aspect, the disclosure relates to a camera head. The camerahead may include, for example, a housing including a top camera headassembly and a bottom camera head assembly, a plurality of thermalextraction PCBs, a plurality of PCB edge heat transfer rings thermallycoupled to the plurality of thermal extraction PCBs, and a cylindricalthermal extraction element thermally coupled between the PCB edge heattransfer rings and the housing to transfer heat from the plurality ofPCBs to the housing. The housing may further include a plurality of LEDsto illuminate an area being imaged. The one or more LEDs may be poweredfrom one or more of the plurality of PCBs.

Various additional aspects, features, and functions are described belowin conjunction with the appended Drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The present application may be more fully appreciated in connection withthe following detailed description taken in conjunction with theaccompanying drawings, wherein:

FIG. 1 is an illustration of a user with an example video inspectioncamera system;

FIG. 2 is an isometric view of a camera head embodiment in accordancewith certain aspects;

FIG. 3 is a side view of the camera head embodiment of FIG. 2;

FIG. 4 is a top down exploded view of the camera head embodiment of FIG.3;

FIG. 5 is a bottom up exploded view of the camera head embodiment ofFIG. 3;

FIG. 6 is a top down exploded view of a rear housing assemblyembodiment;

FIG. 7 is an isometric detailed view of a cut toroidal shaped thermalextraction element embodiment;

FIG. 8 is a top down exploded view of a camera module embodiment;

FIG. 9 is a top down exploded view of a light module embodiment;

FIG. 10 is a sectional view of the embodiment of FIG. 3 along line10-10;

FIG. 11 is detailed view of section 11 of the embodiment of FIG. 10showing the rear housing case, thermal extractor, and camera PCB;

FIG. 11 is a top detailed view of embodiments of a camera PCB andthermal extracting element;

FIG. 12 is an illustration describing the configuration of the cameraPCB embodiment;

FIG. 13 is detailed cutaway view of the camera PCB embodiment;

FIG. 14 is an isometric view of an alternative camera head embodiment inaccordance with certain aspects;

FIG. 15 is a partially exploded view of the camera head embodiment fromFIG, 14;

FIG. 16 is a top down exploded view of the thermal extraction assemblyfrom FIG. 15;

FIG. 17 is a bottom up exploded view of the thermal extraction assemblyfrom FIG. 15;

FIG. 18 is a sectional view of the embodiment of FIG. 14 along line18-18.

FIG. 19 is an illustration of the arrangement of components within apossible camera head embodiment in keeping with the present disclosure;

FIG. 20 is an illustration of the arrangement of components withinanother camera head embodiment in keeping with the present disclosure;

FIG. 21 illustrates an embodiment of camera head electronics and PCBs inaccordance with certain aspects;

FIGS. 22 and 23 illustrate details of a PCB embodiment with an edge heattransfer ring;

FIGS. 24 and 25 illustrate details of a housing embodiment and anassociated thermal extraction element embodiment shown positioned withinthe housing;

FIG. 26 illustrates details of a camera head PCB and optics embodimentand a corresponding cut toroidal shaped thermal extraction elementembodiment;

FIG. 27 illustrated details of an alternate thermal extraction elementembodiment;

FIGS. 28-34 illustrate details of alternate thermal extraction elementembodiments; and

FIG. 35 illustrates details of a lighting device embodiment including athermal extraction architecture.

DETAILED DESCRIPTION

Overview

Various details of the disclosure herein may be combined with inspectioncamera systems and components such as those described in co-assignedpatents and patent applications including U.S. Pat. No. 6,697,102,issued Feb. 24, 2004, entitled BORE HOLE CAMERA WITH IMPROVED FORWARDAND SIDE VIEW ILLUMINATION, U.S. Pat. No. 6,831,679, issued Dec. 14,2004, entitled VIDEO CAMERA HEAD WITH THERMAL FEEDBACK LIGHTING CONTROL,U.S. Pat. No. 6,862,945, issued Mar. 8, 2005, entitled CAMERA GUIDE FORVIDEO PIPE INSPECTION SYSTEM, U.S. Pat. No. 6,958,767, issued Oct. 25,2005, entitled VIDEO PIPE INSPECTION SYSTEM EMPLOYING NON-ROTATING CABLEDRUM STORAGE, U.S. patent application Ser. No. 11/928,818, filed Oct.30, 2007, entitled PIPE MAPPING SYSTEM, U.S. Provisional PatentApplication No. 61/034,907, filed Mar. 7, 2008, entitled PIPE INSPECTIONIMAGING SYSTEM, U.S. patent application Ser. No. 12/399,859, filed Mar.6, 2009, entitled PIPE INSPECTION SYSTEM WITH SELECTIVE IMAGE CAPTURE,U.S. patent application Ser. No. 12/704,808, filed Feb. 12, 2010,entitled PIPE INSPECTION SYSTEM WITH REPLACEABLE CABLE STORAGE DRUM. Thecontent of each of these applications is incorporated by referenceherein in its entirety. These applications may be individually orcollectively referred to herein as the “incorporated applications.”

In accordance with various aspects, a camera head with thermalextraction architecture may include a camera head capable of reducingthermal resistance for heat sensitive components such as digital imagesensors. Such a camera head may be used in a variety of applicationsincluding, in an exemplary embodiment, in a pipe inspection system.

In one aspect, a camera head with a thermal extraction architectureconfiguration may include a housing or mounting assembly or othercomponent including a thermal contact area, a printed circuit board(PCB), and a thermal extraction (also denoted herein as “extracting”)element disposed between the PCB and housing to transfer heat from thePCB to the housing and external environment.

The PCB may contain a series of thermal extracting, electricalconnecting, and/or insulating layers. The thermal extracting layer orlayers and/or electrical connecting layer or layers may alternate withinsulating layers between each, such that the thermal extracting layersnever directly come in contact with the electrical connecting layers.

The sides or other areas or surfaces of the thermal extraction PCB maybe configured to allow the thermal extraction piece or element to makecontact with the thermal extracting layer or layers to conduct heat awayfrom the PCB, such as at the contact areas. In turn, the thermalextracting piece or element may contact the housing or assembly toconduct heat from the PCB to the housing or assembly. A reduction ofthermal resistance to heat sensitive components on the specialized PCBmay be achieved whereby heat may be channeled away from sensitivecomponents through the thermal extracting layers, through the thermalextraction element, and redistributed to the camera head housing orassembly. In some embodiments, the camera head may have several PCBs ora PCB stack where a thermal extraction element may be used for each PCB.

In another aspect, a thermally conductive shoe or ring may be securedalong the edge of a thermal extracting PCB, such as by solder. Thethermally conductive shoe may contact a thermal extraction element thatfurther redistributes heat away from sensitive components on the PCB andto the device housing or assembly. In some embodiments a stack ofmultiple thermal extracting PCBs may be used, in which case each PCB mayreceive a thermally conductive ring, and a single thermal extractionelement may encapsulate the stack of thermal extracting PCBs to providebulk heat transfer. In yet other embodiments where a stack of multiplethermal extracting PCBs may be used, each PCB may receive a thermallyconductive shoe as well as an individual thermal extraction element foreach thermal extracting PCB.

In another aspect, the camera head may include a lighting element togenerate light for illuminating a subject area, for instance using lightemitting diodes (LEDs).

In another aspect, a thermal extraction PCB may be a rectangular,square, or other non-round shapes. Furthermore, the thermal extractionelement or elements need not fully encapsulate the sides of the thermalextraction PCB or PCBs. For example, some embodiments may have onethermal extraction element only along one or two sides of a rectangularthermal extraction PCB.

In another aspect, the thermal extraction architecture described hereinin combination with camera heads may also be used in a wide variety ofother systems and devices where cooling of internal components is neededor desired. For instance, LED lighting systems may benefit from coolingof stacks of LED driver circuits using such a thermal extractionarchitecture.

In another aspect, the disclosure is directed to an electronic device,such as a camera, lighting device, or embedded computing or processingdevice. The device may include, for example, a printed circuit board(PCB). The printed circuit board may include a PCB thermal extractionarea. The device may further include a housing assembly elementincluding a housing thermal contact area. The device may further includea thermal extraction element including a first thermal contact area inthermal contact with the PCB thermal extraction area and a secondthermal contact area in thermal contact with the housing thermal contactarea. Heat may be transferred from the PCB to the thermal extractionelement and then to the housing and external environment.

The PCB thermal extraction area may, for example, be along an edge orside of the PCB or adjacent to the edge of a side of the PCB. The PCBmay be a circular or oval PCB. The PCB may be a square or rectangularPCB. The PCB may be shaped to conform to an internal volume of thehousing. The device may further include a PCB edge heat transfer ring orshoe. The PCB edge heat transfer ring may be disposed between the PCBthermal extraction area and the thermal extraction element first contactarea. The PCB edge heat transfer ring may be soldered or otherwiseattached to the PCB and/or the thermal extraction element.

The PCB may, for example, include a plurality layers including at leasta first thermal extraction layer integral with or coupled to the PCBthermal extraction area. The plurality of layers may include one or moreinsulation layers and one or more electrical connection layers. The oneor more electrical connection layers may be electrically isolated fromthe first thermal extraction area and the PCB thermal extraction area.The plurality of layers may include a first electrical connection layerand a first insulation layer. The first insulation layer may be disposedbetween the first electrical connection layer and the thermal conductionlayer.

The thermal extraction element may be shaped in a cut toroidal shapehaving upper and lower lips and a mid section. The upper and/or lowerlips may be in thermal contact with the housing thermal contact area andthe mid section may be in thermal contact with the PCB thermal contactarea.

The device may further include, for example, an imaging sensor togenerate images or a video stream disposed on the PCB. The may furtherinclude one or more LEDs and one or more LED light power circuitsdisposed on the PCB. The device may further include a microprocessor ordigital signal processor or other processing device or processingelement for processing signals from the camera, which may be disposed onthe PCB.

The thermal extraction element may, for example, be in a circular oroval shape. The thermal extraction element may be in a combined S shapeor other shape. The thermal extraction element may be in a cylindricalshape. The cylindrical shape may include a plurality of tabs or otheroutward and/or inward projecting structures. The tabs may be in thermalcontact with one or more PCB thermal contact areas and/or the housingthermal contact areas. The device may further include one or moreadditional PCBs having thermal contact areas. The thermal contact areasof the one or more additional PCBs may be in thermal contact with one ormore of the tabs. The device may further include a plurality of heattransfer rings or shoes. The heat transfer rings or shoes may be inthermal contact between the PCB thermal contact areas and the thermalextraction element. The housing may include an internal groove or slotto retain the thermal extraction element. The housing may include aridge or ring to retain the thermal extraction element.

In another aspect, the disclosure is directed to a camera head. Thecamera head may include, for example, a housing including a top camerahead assembly and a bottom camera head assembly, a plurality of thermalextraction PCBs, a plurality of PCB edge heat transfer rings thermallycoupled to the plurality of thermal extraction PCBs, and a cylindricalthermal extraction element thermally coupled between the PCB edge heattransfer rings and the housing to transfer heat from the plurality ofPCBs to the housing. The housing may further include a plurality of LEDsto illuminate an area being imaged. The one or more LEDs may be poweredfrom one or more of the plurality of PCBs.

Various additional aspects, features, and functions are described belowin conjunction with FIGS. 1 through 35 of the appended Drawings.

It is noted that as used herein, the term, “exemplary” means “serving asan example, instance, or illustration.” Any aspect, detail, function,implementation, and/or embodiment described herein as “exemplary” is notnecessarily to be construed as preferred or advantageous over otheraspects and/or embodiments.

Example Embodiments

Turning to FIG. 1, a thermal extraction architecture camera systemembodiment in accordance with various aspects is illustrated in anexample buried pipe video inspection application. A camera headembodiment, such as the camera head 110, may be configured with athermal extraction architecture such as described herein and may besecured to a push-cable 120, which may be coupled to a cable reel 130(and associated components, such as those described in the incorporatedapplications).

In operation, a user 140 may feed the push-cable 120 with attachedcamera head 110 from the cable reel 130 into a pipe 150. The camera head110 may generate and provide images and/or a video signal to bedisplayed on a camera control unit or CCU 160, such as to locate andimage clogs, obstructions, breaks, or other problem areas within thepipe 150. Because a compact and water tight camera head is needed insuch a pipe inspection application (e.g., due to presence of water orother contaminants), overheating may become a problem. In suchapplications, a camera head designed with a thermal extractionarchitecture such as described herein to extract heat away from any heatsensitive components may be particularly desirable. In a typical thermalextraction architecture, one or more PCBs or other electronic circuitsubstrates include a thermal contact area, such as at the edge of thePCBs, to transfer heat away from the PCB. The PCB may include heattransfer layers, which may be thermally coupled to heat generatingelements of the associated electronic circuit, such as power supplycomponents, high-speed digital components, imaging sensors, processors,lighting elements, or other electronic components that generatesignificant heat either alone or in the aggregate. A thermal extractionelement including a first thermal contact area for contact with thethermal extraction area of the PCB and a second thermal contact area forcontact with a thermal extraction area of an associated device body orhousing, may be positioned between the PCB and housing so as to transferheat from the PCB to the housing and then to the external environment.The thermal extraction element may be flexible so as to allow a pressedfit between the housing and the PCB, and may contact the PCB for heattransfer entirely or primarily along the edges of the PCB. Flexibilityof the thermal extraction element may also aid in reducing vibration orshock impacts applied to the device, which may protect sensitivecomponents and/or reduce impact damage to the device. In an exemplaryembodiment, the thermal extraction architecture is implemented in acamera head or other video or still imaging device or lighting device,however, other embodiments may include any device having an enclosedvolume where heat is generated, such as compact or miniaturemicroprocessor-based devices, digital signal processing devices, orother devices that generate heat via analog or digital circuitry.

Attention is now directed to FIGS. 2 and 3, which illustrate details ofan exemplary embodiment of a camera head 200 having a thermal extractionarchitecture to direct internal heat to an outer housing or assembly andthen to the external environment. Camera head embodiment 200 may includea front housing piece or element 210 and a rear housing assembly 220, orthe housing may include few elements or a single integral element.Various other configurations of housings or housing assemblies or otherstructural heat sink elements may be used in alternate embodiments.

A pin connector 230 may extrude from rear of the rear housing assembly220, such as to direct images or video signals, data, or otherinformation or power to or from the camera head. A camera module 240 anda light module 250 (as shown in FIG. 2) may be fitted inside the fronthousing piece 210 so as to provide an illuminated forward field ofvision to the camera module 240. Glass, plastic, or sapphire ports maybe used to provide strength and protection against impacts, scratches,and other damage, such as for cameras deployed within underground wateror sewer lines.

Turning to FIGS. 4 and 5, top-down and bottom-up exploded views ofadditional details of the embodiment 200 of FIG. 2 further illustratethe internal assembly of the camera head embodiment 200 andcorresponding thermal extraction architecture. During assembly, the topend of the camera module 240 may be seated within the center hole of thelight module 250 with a retainer ring 410 situated in between. A smallO-ring 420 may be fitted within the front housing piece 210 to helpcreate a water tight seal. A foam spacer disk 430 and a desiccant disk440 may be positioned between the bottom side of the camera module 240and the rear housing assembly 220 such that they may fit within the rearhousing assembly 220. The desiccant disk 440 may comprise materialsdesigned to maintain dryness within the camera head. The foam spacerdisk 430 and/or the desiccant disk 440 may be formed with a series ofcentrally located holes, allowing connections from the pin connector 230to the pass through. One or more housing O-rings 450 may be fittedbetween the front housing piece 210 and rear housing assembly 220creating a water tight seal.

In order to facilitate channeling of heat from the interior of thecamera head to the outer housing or assembly to dissipate heat, thecamera head may include a thermal extraction architecture. Sucharchitecture may include housing or assembly elements or components withthermal contact areas, as well as a thermal extraction element and aprinted circuit including a thermal extraction area to channel heat tothe thermal extraction element and then to the housing and exteriorenvironment.

For example, as shown in FIG. 6, the rear housing assembly 220 mayinclude a rear housing element 610, which may be substantiallycylindrical in an exemplary embodiment, along with a thermal extractionelement embodiment 620, in this example in the shape of a cut toroid, aswell as a connector O-ring 630, pin connector 230, a snap ring 640, anda large connector O-ring 650.

The thermal extraction element 620, as shown in greater detailed in FIG.7, may be largely toroidal in shape in an exemplary embodiment and maybe cut along a line paralleling the circumference as shown. Additionalimages of implementation of a thermal extraction element as shown inFIG. 7 are shown in FIGS. 25 and 26. The thermal extraction elements maycomprise metallic or non-metallic thermally conductive materials, suchas metals, thermally conductive plastics, ceramics, composites, carbonmaterials, or other materials or compounds having high thermalconductivity. The thermal extractor element may include a first surfaceor area configured to be in thermal contact with a PCB where heat may begenerated, as well as a second surface or area configured to be inthermal contact with the housing or assembly. Slots or grooves may becut into the sides of the thermal extraction elements to provideadditional flexibility and springiness and/or to reduce weight orprovide better thermal contact areas or orientation of the thermalextraction element within the housing.

In an exemplary embodiment, the sides of the thermal extraction element620 may be concave such that horizontal planes that intersect a topextractor lip 722 and a bottom extractor lip 724 on the toroid are oflarger diameter than that of the horizontal plane that would bisect theextractor mid-section 726. Returning to FIG. 6, the thermal extractionelement 620 may be dimensioned to snugly fit within rear housing piece610 such that the top extractor lip 722 and the bottom extractor lip 724make contact with the inner surface of the rear housing piece 610 at athermal contact area or areas of the housing, such as through slightpressure caused by the flexibility and springiness of the thermalextraction element .

The small connector O-ring 630 and pin connector 230 may be configuredto fit into the rear of the rear housing piece 610 with the snap ring640 securing the pin connector 230 in place. The large connector O-ring650 may then be fitted into the rear of the rear housing piece 610 toprovide a waterproof seal between the camera head 200 (FIG. 2) and anapplicable device such as the pipe inspection system described inconnection with FIG. 1. The rear of the rear housing piece 610 may alsobe formed with threads to connect the camera head 200 (FIG. 2) to camerasystems such as the pipe inspection system described in connection withFIG. 1.

As shown in FIG. 8, a camera module embodiment 240 may include one ormore printed circuit boards (PCBs), such as a thermal extracting cameraPCB 810, which may be secured between a lower bracket 820 and a lensmount 830 by a set of screws 840 or other attachment mechanisms. Thelower bracket 820 and lens mount 830 may be largely disk shaped in anexemplary embodiment. The lower bracket 820 may further be formed with acentral hole allowing connections from the pin connector 230, bestillustrated in FIG. 4, to pass through to the camera PCB 810. An imageof a similar embodiment of a camera module is shown in FIG. 26.

The lens mount 830 may further be formed with a central threadedcylinder designed to mate with the male threaded end of a lens module850. The lens module 850 may contain a series of lenses tailored to theparticular application of the camera head 200 (FIG. 2). The lens mount830 may further be formed with two conical guide tubes designed to holdtwo electrical connecting spring pins 860 in place. The two electricalconnecting spring pins 860 may be coupled to the camera PCB 810 toprovide an electrical connection for delivery of electrical current tothe light module 250 (best illustrated in FIG. 4). One or more filters,such as the IR filter 870, may by seated on top of the image sensor ofthe camera PCB 810. Heat may be removed from PCBs such as PCB 810through the edge of the board, and an optional edge ring, such as shownin FIG. 23, may be thermally coupled to the PCB to direct heat outwardfrom the PCB to an adjacent thermal extraction element.

Turning to FIG. 9, light module embodiment 250 may include a windowpiece or element 910, an LED reflector 920, a light module PCB 930,which may include one or more light emitting diodes or LEDs 940, and aretaining ring 950. The window piece 910, LED reflector 920, lightmodule PCB 930, and/or retaining ring 950 may all be largely toroidal inshape and dimensioned to allow the top section of the camera module 240to pass through the center of each of the light module 250 components.

The window piece or element 910 may comprise a material with translucentor transparent properties allowing light to pass though from poweredLEDs 940 on the light module PCB 930. In assembly, the LED reflector 920may be positioned between the window piece 910 and light module PCB 930.Holes formed through the surface of the LED reflector 920 may be formedto allow each LED 940 to pass through and effectively illuminate thework area. The LED reflector 920 may further be composed of reflectivematerial allowing light from the LEDs 940 to more effectively light thework area. The retaining ring 950 may screw into place behind the lightmodule PCB 930 securing the window piece 910, LED reflector 920, lightmodule PCB 930 with LEDs 940, and retaining ring 950 together. Theretaining ring 950 may be sized to allow the electrical connectingspring pins 860 (FIG. 8) access to connections on the back side of thelight module PCB 930 in order to pass electrical current to the lightmodule 250.

FIGS. 10-12 further illustrate additional details of theinter-relationship between the rear housing element embodiment 610, thethermal extraction element embodiment 620, and the heat extracting PCBembodiment 810 in accordance with an exemplary camera head embodiment.During manufacturing/assembly, the top extractor lip 722 and/or bottomextractor lip 724, being of larger diameter than extractor mid-section726 may contact the inner surface of the rear housing element 610 at oneor more thermal contact areas. The extractor mid-section 726, being ofsmaller diameter than the top extractor lip 722 and bottom extractor lip724 may contact the sides along the circumference of the camera PCB 810.The central area of the thermal extraction element may simultaneously bein thermal contact with one or more thermal contact areas of one or moreinternal PCBs (e.g., PCB 810) to direct heat from the PCBs to the rearhousing element 610.

As illustrated in the detailed cutaway of the camera PCB 810 in FIG. 13,the camera PCB 810 may comprise multiple layers of different materialsto provide different functions including masking, thermal conduction,electrical insulation, and/or other circuit board functions. Forexample, in an exemplary embodiment, the camera PCB embodiment 810 maycomprise one or more thermal extraction layers 1310, one or moreinsulating layers 1320, one or more electrical connecting layers 1330,and/or other layers (not shown).

The layering of the thermal extraction layers 1310 and the electricalconnecting layers 1330 may alternate back and forth with, for example,one of the insulating layers 1320 between each such that none of thethermal extraction layers 1310 and none of the electrical connectinglayers 1330 ever come into direct contact. One or more of the thermalextraction layers 1310 may connect to a side thermal connector sectionor area 1340 that may run along the circumference of the camera PCB 810or may otherwise provide a thermal extraction area. The side area 1340may be integral with our thermally coupled to an optional PCB edge heattransfer ring.

A gap, as illustrated in FIG. 13, may be formed between the side thermalconnector section 1340 and the electrical connecting layers 1330. Thegap may be filled with pre-preg (pre-impregnated composite fibres) orsimilar epoxy resin with insulating properties in manufacture. Soldermask layers 1350 may also be included on the top and bottom face of thecamera PCB 810. In assembly, the side thermal connector section 1340 maymake contact with the extractor mid-section 726.

One or more vias, such as via 1360, may further be used to electricallyconnect components connected to the electrical connecting layers 1330.In PCB embodiment 810, a gap may be formed between the thermalextraction layers 1310 and the via 1360 preventing the via 1360 withconnected electrical connecting layers 1330 from directly physicallycontacting the thermal extraction layers 1310. The gaps between thethermal extraction layers 1310 and via 1360 may fill with pre-preg orsimilar epoxy resin with insulating properties in manufacture. Inalternative embodiments, the gaps between the side thermal connectorsection 1340 and the electrical connecting layers 1330 and between thethermal extraction layers 1310 and via 1360 may also be filled withadditional insulating material. In assembly, the side thermal connectorsection 1340 may make contact with the extractor mid-section 726. Acamera head, such as the camera head 200 (FIG. 2) may be able to reducethermal resistance and effectively redistribute heat from componentssuch as those on the camera PCB 810 into rear housing piece 610 (FIG.6).

In use, a camera head, such as the camera head 200 (FIG. 2), may be ableto reduce thermal resistance and effectively redistribute heat fromcomponents such as those on the camera PCB 810 and/or other internalPCBs (not shown) into rear housing piece 610.

Turning to FIGS. 14-19, another camera head embodiment 1400 may includea top camera head assembly 1510, a bottom camera head assembly 1520, athermal extraction assembly 1530, a lens assembly 1540, and a set ofbolts 1550 and nuts 1560 that may be used to secure the PCB stack of thethermal extraction assembly 1530 to the lens assembly 1540.

The thermal extraction assembly 1530, as best illustrated in FIGS. 16and 17, may include a series of thermal extraction PCBs 1610-1616, PCBshoes or edge heat transfer rings 1620 dimensioned to be secured abouteach of the thermal extraction PCBs 1610-1616, a series of PCB spacers1630, and a thermal extraction element 1650 in a cylindrical shape.

The thermal extraction PCBs 1610-1616 may be designed with heatextracting layers similar to the camera PCBs 810 of FIG. 8. Each of thePCB rings 1620 may include nickel coated aluminum or other highlythermally conductive materials. In assembly, adhesives or solder, suchas a low temperature solder, may be used to secure one PCB ring 1620about each PCB 1610-1616. In use, the PCB shoes 1620 may protect theedges of the PCBs 1610-1616 while still allowing an efficient transferof heat away from sensitive components on the PCBs 1610-1616. Two PCBspacers 1630 may be positioned between each PCB 1610-1616 such that eachPCB spacer may be located above one of two holes formed through each ofthe PCBs 1610-1616.

In assembly, the bolts 1550 may be made to pass through the holes formedthrough the PCBs 1610-1616, through the center of the PCB spacers 1630,through holes formed through the lens assembly 1540, and fasten withnuts 1560. The thermal extraction element 1650 may be of a sheet ofbrass or other highly thermally conductive material with a series ofetched, punched, die-cut, or otherwise formed tabs throughout. As bestillustrated best in FIG. 19, when assembled, the thermal transferelement 1650 may be bent or rolled into a cylindrical shape that may beseated within the bottom camera head assembly 1520. The tabs formedthroughout the thermal extraction element 1650 may be bent inward and/oroutward to provide thermal contact areas. For example, the tabs may bebent inward such that each of the PCB shoes 1620 may contact the tabs onthe thermal extraction element 1650. Furthermore, the thermal extractionelement 1650 may be dimension such that the outward facing side of thethermal extraction element 1650 may contact the housing of the bottomcamera head assembly 1520 allowing heat from components on the PCBs1610-1616 to be channeled through the thermal extraction PCBs 1610-1616,through the PCB shoes 1620, the thermal extraction element 1650, and tothe housing of the bottom camera head assembly 1520, either directlywith the thermal extraction element in direct contact with the housingor with outward bent tabs in contact with the housing (e.g., as shown inFIG. 34).

In assembly, a series of bottom tabs on the thermal extraction element1650 may be formed to act as a stop when the stack of PCBs 1610-1616 isinserted into the housing of the bottom camera head assembly 1520containing the thermal extraction element 1650. In some embodiments, thesingular thermal extraction element 1650 designed to encapsulate thesides of the stack of thermal extraction PCBs 1610-1616 of FIGS. 15-16may be substituted for multiple thermal extraction elements 2050 asillustrated in FIG. 20. In such embodiments, one thermal extractionelement 2020 may be made to secure to each PCB shoe or ring 2020. ThePCB shoes or rings 2020 of FIG. 20 may be similar to PCB shoes or rings1620 of FIGS. 16-19 except with a groove formed along the outsideallowing a thermal extraction element 2020 to be secured thereto.

FIG. 21 illustrates details of an embodiment of camera head electronics2100 including four stacked PCBs 2110 each having a PCB edge heattransfer ring 2115 to aid in transfer of heat from the edges of the PCBsto thermal extraction elements (not shown). The top PCB includes opticalelements 2120 above an onboard imaging sensor mounted on the PCB.Additional PCBs below the top board include additional electronics,processing elements, power supply or control elements, and the like.

FIGS. 22 and 23 illustrate details of an example embodiment of a roundPCB assembly 2200 as may be used in a camera head or other device, suchas an LED light (e.g., as shown in FIG. 35). PCB assembly 2200 includesa PCB 2210 and an optional PCB edge heat transfer ring 2215 to aid intransferring heat from the PCB edges to adjacent thermal extractionelements (not shown). PCB 2210 may include one or more internal heatconducting layers and heat may be transferred either directly from thoselayers at the edge of the PCB to the thermal extraction element or maybe transferred to the ring 2215 and then to the thermal extractionelement. In some embodiments, additional heat transfer structures may beused, such as heat transfer pads or rings on the tops or bottoms of thePCBs in contact with the edges, or other heat transfer structures fordirecting heat to be removed from the boards to the heat extractionelement.

FIGS. 24 and 25 illustrate details of parts of an example camera headembodiment 2400. Camera head 2400 includes a metallic housing 2400,along with an interior circuit board with pins 2450 to provide powerand/or signal contacts to additional circuit boards such as those shownin FIGS. 21-23. FIG. 25 illustrates the housing 2430 with a thermalextraction element embodiment 2440 removed, and FIG. 24 illustrates thehousing 2430 with the thermal extraction element 2440 installed in thehousing in a channel cut into the interior of the housing. When a PCB isplaced into the housing as shown in FIG. 24, the PCB edges are incontact with the central contact area of the thermal extraction element,and the lips of the thermal extraction element are in thermal contactwith a contact area of the housing (at the edges of the slot or channel)to transfer heat from the thermal extraction element to the housing andthen to the exterior environment (e.g., other heat conductors, solids,gases, liquids, etc.).

FIG. 26 illustrates additional details of an exemplary cut toroidalthermal extraction element 2640 with slots to aid in flexing of thethermal extraction element when placed between PCBs and a housing. Inaddition to aiding in thermal contact through pressure applied on thethermal extraction element by the PCB edges and housing, the flexingconfiguration of the thermal extraction element may also aid in shock orimpact resistance of electronic devices such as cameras, lights, and thelike by absorbing some of the energy of impact. For example, videoinspection cameras for deployment within buried pipes, such as water orsewer lines, may be subject to impact onto the edge of pipes, or at Ys,Vs, bends in the pipes, or with obstructions such as root growth, pipebreakages, and the like. Including a flexible thermal extraction elementsuch as the cut toroidal element shown in FIGS. 24-26 may aid in shockand impact resistance, especially for devices with sensitive opticaland/or electronic components within the housing.

As shown in FIG. 26, in an exemplary camera head embodiment, the camera2600, including PCB 2615 and associated onboard optics, is approximatelythe size of a United States nickel coin. Thermal extraction element 2640is similarly sized in this embodiment.

FIG. 27 illustrates another exemplary thermal extraction elementembodiment, in this case a tabbed thermal extraction element 2740 in apartially wound configuration. Thermal extraction element 2740 may befurther wound in a circle or oval shape such that the ends join, and thepunched or die-cut tabs as shown may be bent outward on one or bothsides to provide thermal contact areas with an adjacent housing and oneor more PCBs.

Although the previously described thermal extraction elements have beenprimarily illustrated in the form of a cut toroidal configuration wherea toroidal shape is cut along a line about the circumference, othershapes may be used in alternate embodiments. FIG. 28 illustrates onecamera head configuration in cross-section where the thermal extractionelement 2840 is in a cut toroidal shape such as that shown in FIGS.24-26, with outer lips of the thermal extraction element captured by anedge 2835 of a slot or groove in housing 2830, and the central area ofthe thermal extraction element 2840 is in thermal contact with a thermalcontact area 2813 at the edge of PCB 2810. An optional heat transferring 2815, such as shown in FIGS. 22 and 23, may be placed along theedges of the PCB 2810 to aid in heat transfer from the PCB to thethermal extraction element. The lips of thermal extraction element 2840are in thermal contact with thermal contact area(s) 2837 of housing 2830to transfer heat from the thermal extraction element to the housing 2830and then to the exterior of the housing or to another heat sink or heatremoval structure.

FIGS. 29-34 illustrate alternate embodiments. For example, FIG. 29illustrates a cross-sectional view of a combined s-curve shaped thermalextraction element 2940 with outer lips captured by the edges 2935 ofhousing 2930, where thermal contact areas 2937 of the housing transferheat from the thermal extraction element to the housing. An optionalheat transfer ring 2915, such as shown in FIGS. 22 and 23, may be placedalong the edges of the PCB 2910 to aid in heat transfer from the PCB tothe thermal extraction element 2940 at thermal contact area 2913.

FIG. 30 illustrates a cross-sectional view of a round or oval shapedthermal extraction element 3040. Housing 3030 may be flat or have agroove or other structure to capture the thermal extraction element. Forexample, in the configuration shown in FIG. 30, the housing may have around or oval shaped groove 3035, and the area around the groove 3037may function as a thermal contact area of the housing in contact withthe thermal extraction element. Similar to FIGS. 28 and 29, an optionalheat transfer ring 3015, such as shown in FIGS. 22 and 23, may be placedalong the edges of the PCB 3010 to aid in heat transfer from the PCB tothe thermal extraction element 3040 at thermal contact area 3013.

FIG. 31 illustrates a cross-sectional view of another thermal extractionelement embodiment 3140 with a tabbed or rounded outer edge 3140 forcontact with thermal transfer areas 3137 of housing 3130, which in thisembodiment has a flat surface rather than a groove or slot (However, itis noted that the housing need not be configured this way and mayinclude grooves, slots, rings, or other structures to retain the thermalextraction element within the housing for aiding heat transfer.). Anoptional heat transfer ring 3115, such as shown in FIGS. 22 and 23, maybe placed along the edges of the PCB 3110 to aid in heat transfer fromthe PCB to the thermal extraction element 3140 at thermal contact area3113.

FIG. 32 illustrates a cross-sectional view of another thermal extractionelement embodiment 3240 with a combined s-curve shaped thermalextraction element 3240 with outer lips captured by a ring or ridge 3235of housing 3230, where thermal contact areas 3237 of the housingtransfer heat from the thermal extraction element to the housing. Anoptional heat transfer ring 3215, such as shown in FIGS. 22 and 23, maybe placed along the edges of the PCB 3210 to aid in heat transfer fromthe PCB to the thermal extraction element 3240 at thermal contact area3213.

In some embodiments, one or both contact area edges of the thermalextraction element may be attached or bonded to the housing and/or PCB.For example, as shown in the embodiment of FIG. 33, solder may be usedat one or more points 3333 to attach thermal extraction element 3340 tohousing 3330 and PCB 3310 and/or ring 3315. This may be done to fix theposition of the thermal contact edges of the thermal extraction elementand/or to aid in conducting heat outward to the housing at contact areas3337.

FIG. 35 illustrates details of another embodiment of a device includinga thermal extraction architecture, in accordance with aspects disclosedherein, in the form of an LED lighting device 3500. FIG. 35 shows acut-away cross-sectional view of light 3500, where the internal printedcircuit boards 3510 are round-shaped and oriented adjacent to each otherin a stacked configuration. Other embodiments may have different PCBshapes and/or orientations, such as square or rectangular-shaped PCBs,oval PCBs, or other PCB shapes or orientations.

Lighting device 3500 includes a housing assembly 3530, which may becomprised of metal or other materials, where at least a portion of thehousing is of a heat conductive material. In operation, individual lightemitted diodes (LEDs) may be mounted on a printed circuit board or othersubstrate. In some embodiments the LEDs may be a single color (e.g.,blue, white, red, etc.) or, in other embodiments such as shown in FIG.35, individual LEDs of different colors, such as red (R), green (G), andblue (B) LEDs may be used to provide a particular color output oradjustable color output. One or more LED driver PCBs, such as PCBs 3510as shown, which may each include power and/or control electronics forthe individual LEDs, may be disposed within the housing and may includewiring from the PCBs 3510 to the individual LEDs (e.g., the R, G, and BLEDs shown near the window at the front of the housing.

The PCBs 3510 may be configured similarly to the round PCBs describedpreviously herein, and may include thermal contact areas, such as on theedges, which are in thermal contact with corresponding flexible thermalextraction elements 3540 to transfer heat from the edges of the PCBs3510 to the housing 3530 and from the housing to the exteriorenvironment. Any of the various thermal extraction element embodimentsdescribed previously herein may be used to provide thermal contactbetween the PCBs 3510, thermal extraction elements 3540, and housing3530. For example, while a configuration similar to that shown in FIG.28 is shown in FIG. 35 to transfer heat from each PCB, otherconfigurations, such as those shown in FIGS. 29-34, or others, may beused in alternate embodiments.

The housing 3530 may further include fins, heat sinks, or otherstructures to enhance thermal transfer to the external environment. Someembodiments of lighting devices in accordance with the aspectsillustrated in FIG. 35 may be for use in air or other gaseousenvironments, whereas other embodiments may be configured in a sealedfashion, such as through use of o-rings or other seals, for underwateror high-pressure environments.

Although the example embodiments described previously herein areillustrated in the context of cameras or lighting devices, similarthermal extraction architectures may be used in other devices where heattransfer from a central or interior area to the device exteriorenvironment may be needed. For example, devices with internal processingelements or other electronics generating significant heat may benefitfrom a similar architecture by including a thermal extraction elementbetween the electronics' PCB and a housing or other element in thermalcontact with the external environment.

In some configurations, the apparatus, circuit, modules, or systemsdescribed herein may include means for implementing features orproviding functions described herein. In one aspect, the aforementionedmeans may be a module including a processing element including aprocessor or processors, associated memory and/or other electronics inwhich embodiments of the invention reside, such as to implement image orvideo capture in a camera head, signal processing, switching, datatransmission or reception to or from a camera head, or other functionsto process and/or condition camera inputs or outputs, lighting deviceinputs or outputs, or other electronic device inputs or outputs. Thesemay be, for example, modules or apparatus residing in cameras, lightingdevices, or other electronic devices or systems including thermalextraction architectures.

In one or more exemplary embodiments, the electronic functions, methodsand processes described herein and associated with cameras may beimplemented in hardware, software, firmware, or any combination thereof.If implemented in software, the functions may be stored on or encoded asone or more instructions or code on a computer-readable medium.Computer-readable media includes computer storage media. Storage mediamay be any available media that can be accessed by a computer. By way ofexample, and not limitation, such computer-readable media can compriseRAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic diskstorage or other magnetic storage devices, or any other medium that canbe used to carry or store desired program code in the form ofinstructions or data structures and that can be accessed by a computer.Disk and disc, as used herein, includes compact disc (CD), laser disc,optical disc, digital versatile disc (DVD), floppy disk and blu-ray discwhere disks usually reproduce data magnetically, while discs reproducedata optically with lasers. Combinations of the above should also beincluded within the scope of computer-readable media.

Various functions in embodiments disclosed herein with respect tocameras and other electronic devices may be implemented or performed inone or more processing elements with a general purpose processor, adigital signal processor (DSP), an application specific integratedcircuit (ASIC), a field programmable gate array (FPGA) or otherprogrammable logic device, discrete gate or transistor logic, discretehardware components, or any combination thereof designed to perform thefunctions described herein. A general purpose processor may be amicroprocessor, but in the alternative, the processor may be anyconventional processor, controller, microcontroller, or state machine. Aprocessor may also be implemented as a combination of computing devices,e.g., a combination of a DSP and a microprocessor, a plurality ofmicroprocessors, one or more microprocessors in conjunction with a DSPcore, or any other such configuration.

The claims are not intended to be limited to the aspects shown herein,but are to be accorded the full scope consistent with the language ofthe claims, wherein reference to an element in the singular is notintended to mean “one and only one” unless specifically so stated, butrather “one or more.” Unless specifically stated otherwise, the term“some” refers to one or more. A phrase referring to “at least one of” alist of items refers to any combination of those items, including singlemembers. As an example, “at least one of: a, b, or c” is intended tocover: a; b; c; a and b; a and c; b and c; and a, b and c.

The previous description of the disclosed aspects is provided to enableany person skilled in the art to make or use the present disclosure.Various modifications to these aspects will be readily apparent to thoseskilled in the art, and the generic principles defined herein may beapplied to other aspects without departing from the spirit or scope ofthe disclosure. Thus, the disclosure is not intended to be limited tothe aspects shown herein but is to be accorded the widest scopeconsistent with the appended claims and their equivalents.

We claim:
 1. An electronic camera, comprising: an imaging sensor; aprinted circuit board (PCB) including electronics for processing imagesfrom the imaging sensor, the PCB including a thermal extraction areaalong at least a side of the PCB; a housing assembly element including ahousing thermal contact area; and a thermal extraction element includinga first thermal contact area in thermal contact with the PCB thermalextraction area a second thermal contact area in thermal contact withthe housing thermal contact area.